Heat conductive mounting and connection of semiconductor chips i

Details Heat conductive mounting and connection of semiconductor chips i Heat conductive mounting and connection of semiconductor chips i

1974-06-14

1976-02-03

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 81, 174 16HS, H01L 3902

Patent

active

039368661

ABSTRACT:
Integrated circuit chips are mounted in electronic assemblies with the chip terminal pads "up" or on the opposite side of the chip from the substrate of the circuit board. The lower chip surface is bonded either directly to the heat-conducting substrate or through an intermediate pedestal of a good heat-conducting volume of metal. Beam leads from the integrated circuit terminals are bonded to relatively large heat-conductive posts acting as spacers, if necessary, between the beam leads and the circuitry pattern.

REFERENCES:
patent: 3414775 (1968-12-01), Melan et al.
patent: 3487541 (1970-01-01), Boswell
patent: 3568012 (1971-03-01), Ernst
patent: 3594619 (1971-07-01), Kamoshida
patent: 3670404 (1972-06-01), Kamoshida
patent: 3684818 (1972-08-01), Netherwood
patent: 3805375 (1974-04-01), Lacombe et al.
patent: 3846824 (1974-11-01), Bell
Electronics; Al Gets Around, p. 38, Dec. 22, 1969.

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