Heat conductive material

Details Heat conductive material Heat conductive material

2005-07-05

2005-07-05

Group, Karl (Department: 1755)

Compositions: ceramic

Ceramic compositions

Carbide or oxycarbide containing

C428S323000, C428S325000, C428S457000, C428S698000

Reexamination Certificate

active

06914025

ABSTRACT:
This invention relates to diamond-containing composite materials that have high thermal conductivity and thermal diffusivity, and to the use of such materials in heat sinks, heat spreading and other heat conductive applications. The material comprises diamond particles silicone carbide and silicon and has a thermal conductivity of at least 400 W/mK and a thermal diffusivity of at least 2.1 cm2/s.

REFERENCES:
patent: 4242106 (1980-12-01), Morelock
patent: 4381271 (1983-04-01), Hayden
patent: 5106393 (1992-04-01), Ringwood
patent: 6171691 (2001-01-01), Nishibayashi
patent: 6270848 (2001-08-01), Nishibayashi
patent: 6447852 (2002-09-01), Gordeev et al.
patent: 0 043 541 (1982-01-01), None
patent: 0 859 408 (1998-08-01), None
patent: WO 99/12866 (1999-03-01), None

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