Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2011-08-23
2011-08-23
Feely, Michael J (Department: 1761)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C428S414000, C428S418000, C523S445000, C523S457000, C523S458000, C525S523000, C525S524000, C525S525000, C525S526000, C525S533000
Reexamination Certificate
active
08003216
ABSTRACT:
A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.
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English Abstract of TW I224123 dated Nov. 21, 2004.
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Third Party Submission filed with Japan Patent Office and English translation.
Chu Fu Hua
Wang David Shau Chew
Yang En Tien
Yu Jyh Ming
Feely Michael J
Polytronics Technology Corporation
Seyfarth Shaw LLP
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