Heat-conductive aluminum nitride sintered body and method of man

Details Heat-conductive aluminum nitride sintered body and method of man Heat-conductive aluminum nitride sintered body and method of man

1989-01-26

1991-07-23

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Refractory

501 98, 264 62, 264 65, C04B 3558

Patent

active

050343572

ABSTRACT:
An aluminum nitride sintered body mainly composed of aluminum nitride, contains 0.01 to 1.0 percent by weight of a rare earth element and 0.001 to 0.5 percent by weight of oxygen. Such a body has a thermal conductivity of at least 180 W/mK. For manufacturing such an aluminum nitride sintered body, aluminum nitride powder (201) is first prepared. At least one compound (203) containing a rare earth element is added to the aluminum nitride powder (201) to contain 0.01 to 1.0 percent by weight, in rare earth element conversion, of the compound. The ingredients are homogeneously mixed with each other. A green body is formed of the mixed powder and sintered at a temperature of 1500.degree. to 2200.degree. C. in a non-oxidizing atmosphere containing nitrogen.

REFERENCES:
patent: 3833389 (1974-09-01), Komeya et al.
patent: 4803183 (1989-02-01), Schwetz et al.
patent: 4847221 (1989-07-01), Horiguchi et al.
Article entitled: "High Thermal Conductive AlN Ceramics by Pressureless Sintering in Reducing Atmosphere" (III)-Investigation of Additives--by Akihiro Horiguchi et al. (Toshiba R&D Center), pp. 969 & 970 of Proceeding for 1987 Yogyo Kyokai's Annual Meeting.
"Aluminum Nitride Substrates Having High Thermal Conductivity" by Iwase et al.; published in Solid State Technology/Oct. 1986.

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