Heat conduction bus, particularly for a microprocessor-based...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S719000, C361S720000, C165S080200, C165S185000

Reexamination Certificate

active

07599186

ABSTRACT:
A heat conduction bus, particularly for a microprocessor-based computation unit, includes a single starting end, a heat-conducting strip (1) provided with a plurality of tabs (7-12) for solder-connecting to the connection terminals of electronic components likely to become hot, and a collector (4) joined to the strip (1) and arranged so as to channel and evacuate the thermal energy drained by the tabs (7-12) and passing through the strip (1). The heat conduction bus includes, at least in line with each of the tabs (11, 12) geometrically the closest to the collector (4), an opening (13, 14) provided in the strip (1) near to the tab (11, 12), so as to be located interposed between the tab and the collector (4) and to form an obstacle opposing the direct routing of the thermal energy between this tab (11, 12) and the collector.

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patent: 7273398 (2007-09-01), Taylor et al.

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