Heat-conducting cooling module

Details Heat-conducting cooling module Heat-conducting cooling module

1985-05-06

1987-03-17

Cline, William R.

Heat exchange

With retainer for removable article

Electrical component

165185, 357 81, F28F 700

Patent

active

046499903

ABSTRACT:
A heat-conducting cooling module for cooling a semiconductor substrate in an integrated circuit package assembly in which a semiconductor substrate is mounted on a base board by small solder pellets, and which contains a single substrate or laminated substrates. A heat-conducting relay member is provided between the semiconductor substrate and a housing so as to be pressed onto the semiconductor substrate. At least either one of the housing or the heat-conducting relay member is made of a sintered product which includes silicon carbide as a chief component.

REFERENCES:
patent: 4153107 (1979-05-01), Antonetti et al.
patent: 4167771 (1979-09-01), Simons
patent: 4226281 (1980-10-01), Chu

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