Heat-bonding method

Details Heat-bonding method Heat-bonding method

1974-06-25

1976-03-16

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156309, B32B 3106, C09J 700, H05B 904

Patent

active

039444546

ABSTRACT:
Thermoplastic materials, such as polyvinylchoride, cannot normally be heat bonded to certain higher-melting synthetic fabrics, such as nylon or the like, which are of the densely woven type and are also frequently treated with silicone or analogous substances to make them water repellant and/or windproof. The present method overcomes this problem by heat-bonding such materials under pressure and the application of a dielectric field, and by causing sufficient dielectric resistance to be present at the synthetic fabric so that the dielectric field is able to heat the synthetic fabric to a temperature at which it becomes sufficiently flowable to bond with the thermoplastic material.

REFERENCES:
patent: 2463054 (1949-03-01), Quayle et al.
patent: 3017484 (1962-01-01), England et al.
patent: 3232810 (1966-02-01), Reesen
patent: 3531365 (1970-09-01), Melin
patent: 3647607 (1972-03-01), Hillers
patent: 3758358 (1973-09-01), Kuroda
patent: 3823052 (1974-07-01), Hargett

Affiliated with

Also associated with

Rating

Heat-bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-bonding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-290948