Heat bonding device

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly

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Details

100 93P, 100211, 100296, 156285, 156498, 156583, B29C 1700

Patent

active

039649580

ABSTRACT:
A device for heat bonding thermoplastic materials. At least one pressure chamber having a diaphragm is spaced from a supporting surface with the diaphragm and supporting surface in opposing relation to each other. Materials to be bonded are positioned between the pressure chamber diaphragm and supporting surface and the pressure in the chamber is raised above ambient pressure causing a deflection of the diaphragm. The amount of diaphragm deflection increases with the distance from the pressure chamber side wall. Either the supporting surface or the pressure chamber, or both, is moved toward the other causing a contact between the deflected diaphragm, supporting surface and the materials to be bonded. As the relative movement continues, the contact area with the materials to be bonded increases thereby progressively expelling air trapped between the materials. When the materials to be bonded are fully supported by the opposing diaphragm and supporting surface, the chamber pressure is greatly increased and heat is applied to the materials through the diaphragm by a heating element carried by the diaphragm. Provision may also be made for cooling of the materials once the bond has been effected.

REFERENCES:
patent: 1806861 (1931-05-01), Owen
patent: 2298037 (1942-10-01), Crandell
patent: 2859796 (1958-11-01), Taunton
patent: 3383265 (1968-05-01), Garabedian
patent: 3738890 (1973-06-01), Johnson et al.

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