Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1985-06-27
1987-02-03
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 86, 156497, 156499, 53441, 53442, 53557, 34210, 34212, 34215, 34216, 34217, 34219, 34223, 34224, 34225, B32B 3126
Patent
active
046407260
ABSTRACT:
A method and apparatus for heating selected portions of an article include transport means for moving the article into a heating compartment. Shroud means, which are disposed within the heating compartment and located adjacent to limited portion of the article, direct a stream of heated gas toward a marginal portion of this article. Supply means deliver a volume rate flow of heated gas to the shroud means, and discharge means remove a volume rate of exhaust gas flow from the heating compartment. The discharge means is constructed and arranged to provide a volume rate of exhaust gas flow from the heating compartment which is greater than the volume rate of heated gas flow supplied into the shroud means.
REFERENCES:
patent: 3115735 (1963-12-01), Harrison
patent: 3197940 (1965-08-01), Spangler
patent: 3245407 (1966-04-01), Mason
patent: 3309789 (1967-03-01), Denker
patent: 3312811 (1967-04-01), Shanklin
patent: 3347013 (1967-10-01), Piazze
patent: 3357153 (1967-12-01), Shaffer
patent: 3402475 (1968-09-01), Johansen et al.
patent: 3430358 (1969-03-01), Denker
patent: 3639917 (1972-02-01), Althouse
patent: 3678516 (1972-07-01), Backer
patent: 3717939 (1973-02-01), Mitchell
patent: 3744146 (1973-07-01), Nichols
patent: 3775222 (1973-11-01), Aspen et al.
patent: 3897671 (1975-08-01), Higgins
patent: 3912565 (1975-10-01), Koch et al.
patent: 4011122 (1977-03-01), Ashcroft
patent: 4337771 (1982-07-01), Pieniak et al.
patent: 4413623 (1983-11-01), Pieniak
Popp Robert L.
Sallee Lorry F.
Kimberly-Clark Corporation
Weston Caleb
Yee Paul
LandOfFree
Heat activation process and apparatus for heat shrinkable materi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat activation process and apparatus for heat shrinkable materi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat activation process and apparatus for heat shrinkable materi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1090258