Heat activation method of thermosensitive adhesive label and hea

Details Heat activation method of thermosensitive adhesive label and hea Heat activation method of thermosensitive adhesive label and hea

1997-01-30

1998-12-08

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156277, 156289, 156322, 156378, 156384, 156521, 73150A, B32B 3100

Patent

active

058463585

ABSTRACT:
A heat activation method for activating a thermosensitive adhesive label having a support and a thermosensitive adhesive layer which is formed on the support and is not adhesive at room temperature, so as to make the thermosensitive adhesive layer adhesive with the application of heat thereto, includes the step of bringing the thermosensitive adhesive layer into contact with a surface portion of a heating medium, at least the surface portion of the heating medium being made of a silicone resin and having a peel strength of 2 g/mm or less with respect to the thermosensitive adhesive layer. There is also disclosed a heat-activating apparatus for heat-activating the above-mentioned thermosensitive adhesive label.

REFERENCES:
patent: 4427744 (1984-01-01), Hume, III
patent: 4707211 (1987-11-01), Shibata
patent: 4746932 (1988-05-01), Sato
patent: 4777079 (1988-10-01), Nagamoto et al.
patent: 4784714 (1988-11-01), Shibata
patent: 5053267 (1991-10-01), Ide et al.
patent: 5110389 (1992-05-01), Hiyoshi et al.
patent: 5248543 (1993-09-01), Yamaguchi et al.
patent: 5413651 (1995-05-01), Otruba
Patent Abstracts of Japan, vol. 18, No. 669, (M-1725), Dec. 16, 1994, JP 06 263128, Sep. 20, 1994.

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