Incremental printing of symbolic information – Thermal marking apparatus or processes
Patent
1997-10-16
2000-02-29
Le, N.
Incremental printing of symbolic information
Thermal marking apparatus or processes
B41J 2315
Patent
active
060315539
ABSTRACT:
A heat activation method for activating a thermosensitive adhesive label having a support and a thermosensitive adhesive layer which is provided on the support and is not adhesive at room temperature, so as to make the thermosensitive adhesive layer adhesive with the application of heat thereto, includes the step of heating the thermosensitive adhesive layer to make the thermosensitive adhesive layer adhesive while transporting the label along a heat-resistant transporting belt heated by a heater, with the thermosensitive adhesive layer being in pressure contact with the transporting belt using a pressure-application member. A heat activation apparatus is provided with a heat-application and transporting member and a pressure-application member. A label printer is provided with a label holder, a printing apparatus, a cutter and the above-mentioned heat activation apparatus.
REFERENCES:
patent: 3779829 (1973-12-01), Wolff
patent: 4397709 (1983-08-01), Schwenzer
patent: 4590497 (1986-05-01), Shibata et al.
patent: 4777079 (1988-10-01), Nagamoto et al.
patent: 5053267 (1991-10-01), Ide et al.
patent: 5110389 (1992-05-01), Hiyoshi et al.
patent: 5248543 (1993-09-01), Yamaguchi et al.
patent: 5773385 (1998-06-01), Katoh et al.
Idenawa Hiroyuki
Iwata Toshinobu
Motosugi Takanori
Nagamoto Masanaka
Le N.
Nghiem Michael
Ricoh & Company, Ltd.
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