Heat activatable adhesive tape for bonding electronic...

Details Heat activatable adhesive tape for bonding electronic... Heat activatable adhesive tape for bonding electronic...

2008-09-30

2008-09-30

Tran, Thao T. (Department: 1794)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

Reexamination Certificate

active

11167721

ABSTRACT:
Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least ofa) an epoxide-modified vinylaromatic block copolymer,b) an epoxy resin andc) a hardener which performs crosslinking with the epoxide groups at high temperatures,the ratio of a to b being between 40:60 and 80:20.

REFERENCES:
patent: 3970608 (1976-07-01), Furukawa et al.
patent: 5229464 (1993-07-01), Erickson et al.
patent: 5369167 (1994-11-01), Pottick et al.
patent: 5478885 (1995-12-01), Masse et al.
patent: 6180719 (2001-01-01), Miyata
patent: 6294270 (2001-09-01), Clough
patent: 6423367 (2002-07-01), Clough
patent: 6447898 (2002-09-01), Pfaff
patent: 6489042 (2002-12-01), Imken et al.
patent: 6797750 (2004-09-01), Taniguchi et al.
patent: 6861138 (2005-03-01), Pfaff et al.
patent: 7156944 (2007-01-01), Moeller et al.
patent: 2002/0155286 (2002-10-01), Kobayashi et al.
patent: 198 53 805 (2000-05-01), None
patent: 102 58 961 (2004-07-01), None
patent: 103 24 737 (2004-12-01), None
patent: 0 658 603 (1995-06-01), None
patent: WO 98/22531 (1998-05-01), None
patent: WO 00/01782 (2000-01-01), None

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