Heat-accumulating microcapsule dispersion

Details Heat-accumulating microcapsule dispersion Heat-accumulating microcapsule dispersion

1996-12-20

1999-06-29

Lovering, Richard D.

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

16510417, 16510421, 252 70, 252 76, 42721334, 42840221, 42840224, C09K 506, B01J 1318

Patent

active

059164786

ABSTRACT:
Heat-accumulating microcapsule dispersion includes a microcapsule provided as a small-diameter heat-accumulating material including organic compound functioning as heat accumulating material in association with a phase change thereof accommodated within a microcapsule, heat transfer fluid medium including a number of the microcapsules dispersed stably therein, and a number of thermal boundary layer stirring particles dispersed in the heat transfer fluid medium. The stirring particles has a volume average particle diameter between 0.1.times.D and 1.9.times.D relative to a layer thickness D of a thermal boundary layer formed inside a heat exchanging passage through which the dispersion is caused to flow. The particles stir the thermal boundary layer in association with movement thereof inside the heat exchanging passage.

REFERENCES:
patent: 4504402 (1985-03-01), Chen et al.
patent: 4708812 (1987-11-01), Hatfield
patent: 4911232 (1990-03-01), Colvin et al.
patent: 5456852 (1995-10-01), Isiguro

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