Heat-absorbing member, cooling device, and electronic apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S699000, C361S702000, C361S704000, C361S715000, C361S719000, C165S080300, C165S080400, C165S104330, C165S185000, C257S714000, C062S003200

Reexamination Certificate

active

07551435

ABSTRACT:
Electronic components differing in height (a CPU2a,a capacitor2b,and coil elements2c) are mounted on a printed circuit board1.A heat-absorbing member3is provided above the printed circuit board1in such a way that the member3contacts not only the top surface of the CPU2athat is the shortest but the sides of the capacitor2band the coil elements2c.To circulate a cooling medium, a flow path4is formed in the heat-absorbing member3.Heat generated at the CPU2ais transmitted from its top surface to the cooling medium in the flow path4via the heat-absorbing member3;heat generated at the capacitor2band the coil elements2cis transmitted from their sides to the cooling medium in the flow path4via the heat-absorbing member3.

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