Header lead roller

Wireworking – Crimping

Patent

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Details

140147, 72DIG10, B21F 4500

Patent

active

041355571

ABSTRACT:
The leads on a Semiconductor Package of the type having a generally round configuration and generally termed a header, are crimped into a conducting relationship for plating by means of an apparatus comprising a track type of conveyer for conveying the headers along a specific path, and a pair of rollers disposed on opposite sides of the track for engaging the leads as the header passes therebetween for crimping the leads together in a conducting relationship. The rollers comprise wheels mounted for rotation in opposite directions at different speeds, such that the header is rotated between the wheels but simultaneously moved in a linear direction along the conveyer.

REFERENCES:
patent: 2390139 (1945-12-01), Vasselli
patent: 3336954 (1967-08-01), Bach et al.
patent: 3570559 (1971-03-01), Palmer
patent: 4003414 (1977-01-01), Halligan

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