Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1987-11-04
1989-06-06
Pirlot, David
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439159, H05K 100
Patent
active
048367907
ABSTRACT:
A header device for receiving an IC card or pack, comprises a housing, which includes an IC-pack holder having an opening through which the IC pack is inserted into and removed from the housing, and a pair of first levers projecting into the IC-pack holder so as to abut an end portion of the IC pack, and a pair of second levers located outside the holder. The first and second levers are coupled to each other at their respective proximal ends, so that they are immovable relative to each other. The coupled levers are rotatably mounted on the housing. If the IC pack is inserted into the housing through the opening, the end portion of the IC pack pushes the respective first levers, thereby rotating both the first and second levers in a first rotation direction. Then, if the second levers are rotated in a second rotation direction reverse to the first rotation direction, the first levers push the IC pack out of the housing.
REFERENCES:
patent: 4193656 (1980-03-01), Ward
patent: 4196954 (1980-04-01), Collignon
patent: 4241966 (1980-12-01), Gomez
patent: 4402563 (1983-09-01), Sinclair
patent: 4531795 (1985-07-01), Sinclair
patent: 4669796 (1987-06-01), Carter
E. I. Du Pont de Nemours and Company
Pirlot David
LandOfFree
Header device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Header device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Header device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-38040