Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1987-10-22
1988-10-18
Pirlot, David
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439159, 439525, H05K 100
Patent
active
047783958
ABSTRACT:
A header apparatus for a flat IC pack having at least one conductive terminal includes a header housing which includes an IC pack chamber, an opening communicating with the IC pack chamber, the IC pack being inserted into and extracted from the opening, and a pair of actuation means, each of which includes drive member having a first surface formed inside the IC pack chamber of the header housing and a first rack, operation member which includes a second rack positioned to face the first rack of the drive means and an operation portion formed outside the IC pack chamber, and a pinion engaged with the first and second racks, wherein the first surface of the drive member is moved in an insertion direction of the IC pack by inserting the IC pack into the IC pack chamber, and pushes the IC pack inserted into the IC pack chamber in a direction opposite to the insertion direction of the IC pack by moving the operation portion of the operation means in the insertion direction of the IC pack.
REFERENCES:
patent: 2987693 (1961-06-01), Walmsley
patent: 4070081 (1978-01-01), Takahashi
patent: 4232926 (1980-11-01), Inouye et al.
patent: 4498047 (1985-02-01), Hexamu et al.
patent: 4582379 (1986-04-01), Fasano
patent: 4623208 (1986-11-01), Kerul et al.
patent: 4669796 (1987-06-01), Carter
U.S. patent application Ser. No. 116,586; Filed 11/4/87 Entitled Header Device; Inventor: Hiroshi Narita.
E. I. Du Pont de Nemours and Company
Pirlot David
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