Head suspension configured for improved thermal performance...

Details Head suspension configured for improved thermal performance... Head suspension configured for improved thermal performance...

2005-11-15

2005-11-15

Heinz, A. J. (Department: 2653)

Dynamic magnetic information storage or retrieval

Fluid bearing head support

Disk record

C360S245800

Reexamination Certificate

active

06965499

ABSTRACT:
A head suspension or head suspension component article configured for solder ball bonding of a head slider to electrical traces on article. The article including electrical traces formed from electrically conductive material with the electrical traces having a bonding region adapted for electrical bonding to a head slider. Also included is a support structure providing support for at least portions of the electrical traces and including a head slider mounting region adapted to receive the head slider. This structure is configured to mechanically and thermally isolate the bonding region of the electrical traces from the head slider mounting region to reduce mechanical and thermal effects of a solder ball bonding process on the article during solder ball bonding of the head slider to the electrical traces. The support structure may be reduced at or around the bonding region, or the conductive material may be increased to dissipate more heat.

REFERENCES:
patent: 5467236 (1995-11-01), Hatanai et al.
patent: 5757585 (1998-05-01), Aoyagi et al.
patent: 5768062 (1998-06-01), Anderson et al.
patent: 5889636 (1999-03-01), Arya et al.
patent: 5896247 (1999-04-01), Pan et al.
patent: 5956209 (1999-09-01), Shum
patent: 5969906 (1999-10-01), Arya et al.
patent: 01043647 (2001-02-01), None

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