Head suspension assembly with electrical interconnect by slider

Details Head suspension assembly with electrical interconnect by slider Head suspension assembly with electrical interconnect by slider

1997-07-30

1999-06-22

Evans, Jefferson

Dynamic magnetic information storage or retrieval

Record transport with head stationary during transducing

Drum record

360103, G11B 548, G11B 560

Patent

active

059148349

ABSTRACT:
A head gimbal assembly allows a simplified, automatable electrical interconnection from the read/write head slider to the head suspension assembly electrical interconnect. The head suspension assembly is constructed as a laminated structure. Using a read/write head slider with electrical bond pads on an upper horizontal surface (i.e, the head slider surface bonded to the head suspension assembly and opposite to the disk-confronting head slider surface), electrical interconnection to bonding zones on the upper horizontal surface of the gimbal region is established using standard automated or semi-automated wire bond tooling technology.

REFERENCES:
patent: 4761699 (1988-08-01), Ainslie et al.
patent: 4789914 (1988-12-01), Ainslie et al.
patent: 4975795 (1990-12-01), Spash
patent: 4996623 (1991-02-01), Erpelding et al.
patent: 5001583 (1991-03-01), Matsuzaki
patent: 5313355 (1994-05-01), Hagen
patent: 5331489 (1994-07-01), Johnson et al.
patent: 5391842 (1995-02-01), Bennin et al.
patent: 5392179 (1995-02-01), Sendoda
patent: 5428490 (1995-06-01), Hagen
patent: 5434731 (1995-07-01), Hagen
patent: 5491597 (1996-02-01), Bennin et al.
patent: 5530604 (1996-06-01), Pattanaik
patent: 5570249 (1996-10-01), Aoyagi et al.
patent: 5737152 (1998-04-01), Balakrishnan
patent: 5754368 (1998-05-01), Shiraishi et al.
patent: 5771138 (1998-06-01), Zarouri et al.
patent: 5781378 (1998-07-01), Heitkamp et al.
"Compatibility of Silicon Planar Heads with conventional Thin Film Heads in Hard Disk Drives", IEEE Transactions on Magnetics, vol. 28, No. 5, Sep. 1992, pp. 2124-2126.

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