Head slider supporting device, disk device and suspension

Details Head slider supporting device, disk device and suspension Head slider supporting device, disk device and suspension

1999-03-19

2002-08-20

Klimowicz, William (Department: 2754)

Dynamic magnetic information storage or retrieval

Head mounting

Disk record

C360S244900

Reexamination Certificate

active

06437944

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a head slider supporting device, a disk device and a suspension, and, in particular, to a magnetic head slider supporting device, an optical head slider supporting device, a magnetic disk device, an optical disk device and a suspension.
As a result of an increase of the frequency of a signal which an information processing apparatus processes, it is requested that the write current frequency of a magnetic disk device be increased from 70 MHz to 200 through 300 MHz, for example. In order to increase the write current frequency, it is necessary to reduce the inductance and the electrostatic capacity of a signal transmission path from a magnetic head slider to a head IC. For this purpose, it is effective to provide the head IC at a position near to the magnetic disk slider. Further, thinning of the magnetic disk device is also requested. It is necessary that the head IC be loaded in the magnetic disk device in a condition in which the thinning of the magnetic disk device is not disturbed, and, also, that the head IC does not come into contact with a magnetic disk and so forth even when a shock is applied to the magnetic disk device.
2. Description of the Related Art
Magnetic disk devices, in each of which a head IC for amplifying a signal read through a magnetic head slider is installed on an arm, are disclosed in Japanese Laid-Open Patent Application Nos.62-217476, 3-108120, 3-187295, 3-192513 and so forth.
However, in each of the above-mentioned magnetic disk devices, because the distance between the magnetic head slider and the head IC is long, it is difficult to reduce the inductance and the electrostatic capacity of the signal transmission path from the magnetic head slider to the head IC. Further, the head IC is packaged in a synthetic resin, and, thereby, is thick. As a result, in order to prevent the head IC from coming into contact with a magnetic disk and so forth when a shock is applied to the magnetic disk device, it is necessary to elongate the distance between adjacent magnetic disks. As a result, the magnetic disk device is thick. Further, because the head IC is packaged in the synthetic resin, the head IC is heavy. As a result, the magnetic head slider is heavy. Thereby, the flying stability of the magnetic head slider above the magnetic disk is degraded, and also, there is a possibility that, when the magnetic head slider comes into contact with a magnetic disk due to a strong shock applied to the magnetic disk device, the shock applied to the magnetic disk is so strong that the magnetic disk is damaged.
As shown in
FIG. 1
, in a head slider supporting device
1
, on the top surface
2
a
of a suspension
2
(hereinafter, the position of the suspension shown in
FIG. 1
is a reference position thereof, and ‘the top surface’ of the suspension means the top surface in this position of the suspension), wiring patterns
3
are formed from the extending end to the fixed end of the suspension
2
, and the magnetic head slider
4
is loaded on the top surface
2
a
of the suspension
2
at the extending end of the suspension
2
.
Here, provision of the head IC
5
will be considered. Due to the arrangement of the wiring patterns
3
, a surface at which the head IC is loaded is limited to the top surface
2
a
of the suspension
2
. When considering an increase of the write current frequency, it is preferable that the head IC
5
be provided at a position near to the magnetic head slider
4
. Therefore, it is assumed that the head IC
5
is loaded on the top surface
2
a
of the suspension
2
near the magnetic head slider
4
.
In order to prevent the head IC
5
from coming into contact with a magnetic disk
6
even when a strong shock is applied to the magnetic disk device, it is necessary that a gap 7 of the distance ‘a’ equal to or longer than 0.15 mm to be provided between the head IC
5
and the magnetic disk
6
.
Recently, in order tot thin the magnetic disk device, the magnetic head slider
5
of a small size (a so-called pico-slider, the height ‘b’ of which is 0.3 mm) has been used. As a result, the distance ‘c’ between the suspension
2
and the magnetic disk
6
is small.
When considering a bare head IC
5
, the bare head IC
5
is cut out from a wafer. Accordingly, the thickness of the bare IC
5
is determined by the thickness of the wafer. At the present time, it is difficult to thin the wafer to less than 0.3 mm. Accordingly, the height (thickness) ‘d’ of the head IC
5
is approximately 0.3 mm minimum.
Therefore, when the bare head IC
5
is simply loaded on the top surface
2
a
of the suspension
2
, it is difficult to obtain the gap equal to or longer than 0.15 mm between the head IC
5
and the magnetic disk
6
. Thus, a special device is needed when the bare head IC
5
is loaded on the top surface
2
a
of the suspension
2
.
SUMMARY OF THE INVENTION
An object of the present invention is to provided a head slider supporting device, a disk device and a suspension by which the above-described problem is solved.
A head slider supporting device, according to the present invention, comprises:
a head slider having a head loaded thereon;
a head IC which controls the head;
a substantially flat supporting member having a portion at which the head slider is loaded and a head IC mounting portion at which the head IC is mounted; and
wires electrically connecting the head slider and the IC,
wherein the head IC is mounted at the head IC mounting portion in a condition in which the head IC projects from one surface of the supporting member so that an amount of projecting of the head IC from the one surface of the supporting member is smaller than the thickness of the head IC.
Thus, the length by which the head IC protrudes from the surface of the supporting member is shorter than the thickness of the head IC. As a result, in a case where a so-called pico-slider is used as the head slider, a gap can be provided between the head IC and a disk such that, even when a strong shock is applied to the disk device, the head IC is prevented from coming into contact with the disk.
A head slider supporting device, according to another aspect of the present invention, comprises;
a suspension, a head IC chip mounting portion being provided on a first surface of the suspension;
a head slider loaded on the first surface of the suspension at an extending end thereof, the head slider integrally including a head;
a head IC chip mounted at the head IC chip mounting portion of the suspension; and
wiring patterns extending along the suspension from a portion of the suspension, at which portion the head slider is loaded, via the head IC chip mounting portion,
wherein the head IC chip is mounted at the head IC chip mounting portion in a condition in which the head IC chip is lowered so that an amount of projecting of the head IC chip from the first surface of the suspension is smaller than the thickness of the head IC chip.
Thus, the length by which the head IC chip protrudes from the first surface of the suspension is shorter than the thickness of the head IC chip. As a result, in a case where a so-called pico-slider is used as the head slider, a gap can be provided between the head IC chip and a disk such that, even when a strong shock is applied to the disk device, the head IC chip is prevented from coming into contact with the disk. Thus, the disk device can be provided in which the pico-slider is used as the head slider, and also, the head IC chip is mounted on the first surface of the suspension on which the head slider is loaded. Each of the wiring patterns, electrically connecting the head slider with the head IC chip, can be as short as several millimeters, because the head IC chip is mounted on the first surface on which the head slider is loaded. As a result, the inductances of the wiring patterns are small. Further, the electrostatic capacities between adjacent wiring patterns are small. Therefore, in a case where the disk device is the magnetic disk device, a signal of, for example, 200

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