Head of ultrasonic wire bonding apparatus and bonding method

Details Head of ultrasonic wire bonding apparatus and bonding method Head of ultrasonic wire bonding apparatus and bonding method

1993-10-25

1994-07-05

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

228 11, H01L 21607

Patent

active

053260147

ABSTRACT:
A head of an ultrasonic wire bonding apparatus for bonding a lead wire to a lead frame, includes a capillary, a capillary supporting member, and a vibrator, vertically arranged and connected to the capillary supporting member, for producing ultrasonic torsional vibration along opposite directions and applying the vibration to the capillary via the capillary supporting member, the vibrator having two piezoelectric elements superimposed on each other via a column member in which magnets are circularly arranged so as to produce the ultrasonic torsional vibration along the opposite directions.

REFERENCES:
patent: 4040885 (1977-08-01), Hight et al.
patent: 5037023 (1991-08-01), Akiyama et al.
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5263630 (1993-11-01), Kanomata et al.

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