Dynamic magnetic information storage or retrieval – Fluid bearing head support – Disk record
Reexamination Certificate
2006-01-10
2006-01-10
Renner, Craig A. (Department: 2652)
Dynamic magnetic information storage or retrieval
Fluid bearing head support
Disk record
C360S234600
Reexamination Certificate
active
06985332
ABSTRACT:
A slider scale package assembly in a head gimbal assembly (HGA) for electrically coupling a slider/magnetic recording (MR) head to a head interconnect circuit in a disc drive includes a flex circuit attached to the back of the slider/MR head which turns the slider/MR head into the slider scale package with at least one repositioned interconnect pad disposed at the back of the slider/MR head. The flex circuit further includes a conductive material, one end of which is electrically bonded to a bond pad of the slider/MR head, and the other end is electrically bonded to a conductive material of the head interconnect circuit via the interconnect pad. A plurality of flex circuits can be made in a sheet format and dividable into a plurality of individual flex circuits to be attached to a plurality of slider/MR heads. The bonding of the conductive material of the flex circuit to the slider/MR head and the bonding of the interconnect pad of the flex circuit to the conductive material of the head interconnect circuit can be done in a separate automated process.
REFERENCES:
patent: 4789914 (1988-12-01), Ainslie et al.
patent: 5396390 (1995-03-01), Arakawa et al.
patent: 5610783 (1997-03-01), Maffitt et al.
patent: 5768062 (1998-06-01), Anderson et al.
patent: 5771138 (1998-06-01), Zarouri et al.
patent: 5815347 (1998-09-01), Pattanaik
patent: 5896248 (1999-04-01), Hanrahan et al.
patent: 62-014310 (1987-01-01), None
patent: 01-312720 (1989-12-01), None
patent: 04-092210 (1992-03-01), None
Jones Gordon Merle
Qualey David Gordon
Schulz Kevin Jon
Sluzewski David Allen
Renner Craig A.
Seagate Technology LLC
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