Head gimbal assembly provided with solder ball connecting...

Details Head gimbal assembly provided with solder ball connecting... Head gimbal assembly provided with solder ball connecting...

2005-12-22

2009-11-17

Evans, Jefferson (Department: 2627)

Dynamic magnetic information storage or retrieval

Fluid bearing head support

Disk record

C360S234600, C029S603060

Reexamination Certificate

active

07619856

ABSTRACT:
Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.

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patent: 2002-025025 (2002-01-01), None
patent: 2002-251705 (2002-09-01), None
patent: 2003-123217 (2003-04-01), None

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