Dynamic magnetic information storage or retrieval – Fluid bearing head support – Disk record
Reexamination Certificate
2006-02-15
2009-02-03
Evans, Jefferson (Department: 2627)
Dynamic magnetic information storage or retrieval
Fluid bearing head support
Disk record
C029S603060, C029S878000, C228S056300
Reexamination Certificate
active
07486480
ABSTRACT:
Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.
REFERENCES:
patent: 5821494 (1998-10-01), Albrecht et al.
patent: 6318624 (2001-11-01), Pattanaik et al.
patent: 6523250 (2003-02-01), Erpelding et al.
patent: 6796018 (2004-09-01), Thornton
patent: 2007/0012749 (2007-01-01), Yamaguchi et al.
patent: 01-130590 (1989-02-01), None
patent: 07-106739 (1995-01-01), None
patent: 11-026918 (1999-01-01), None
Satoh Takuya
Tsuchiya Tatsumi
Uematsu Yoshio
Yoshida Tatsushi
Evans Jefferson
Henkhaus John
Hitachi Global Storage Technolgies Netherlands B.V.
Townsend and Townsend / and Crew LLP
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