Head assembly for chip mounter

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S743000

Reexamination Certificate

active

07493689

ABSTRACT:
A head assembly for a chip mounter is provided. The head assembly includes: a housing having a plurality of spindle receiving holes; nozzle spindles that are fitted with nozzles picking up and mounting electronic components and vertically movably inserted into the spindle receiving holes; a selection member selecting at least one of the nozzle spindles and vertically moving the selected nozzle spindle; a horizontal driver horizontally moving the selection member and changing a nozzle spindle to be selected; and an elevating driver vertically moving the selection member.

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patent: 2003-273582 (2003-09-01), None

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