HDI impedance matched microwave circuit assembly

Wave transmission lines and networks – Coupling networks – With impedance matching

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Details

333246, 333247, 257664, 257728, H03H 738, H05K 310, H05K 330

Patent

active

053551028

ABSTRACT:
Active components of a microwave system are interconnected on a substrate by a dielectric-overlay, high-density-interconnect structure in a manner which provides close impedance matching, minimizes impedance discontinuities and substantially increases the yield of good circuits.

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patent: 4731648 (1988-03-01), Parmentier et al.
patent: 4768004 (1988-08-01), Wilson
patent: 4781482 (1988-06-01), Fukuta et al.
patent: 4808769 (1989-02-01), Nakano et al.
patent: 4811081 (1989-03-01), Lyden

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