HCEC blown rigid foams with low thermal conductivity

Details HCEC blown rigid foams with low thermal conductivity HCEC blown rigid foams with low thermal conductivity

1991-09-20

1993-10-19

Foelak, Morton

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Cellular products or processes of preparing a cellular...

521172, 521174, C08J 914

Patent

active

052546012

ABSTRACT:
Rigid polyurethane foams having low thermal conductivity values are produced by reacting an organic polyisocyanate with an organic material having at least two isocyanate reactive hydrogen atoms and an OH value of from about 200 to about 650 in the presence of a blowing agent. The blowing agent is a mixture of 1,1-dichloro-2,2,2-trifluoroethane (HCFC-123) or dichlorofluoroethane (HCFC-141b) and from about 0.1 to about 1.0% by weight (based on total weight of the foam forming mixture) water. The foams obtained are characterized by a thermal conductivity of less than about 0.130 Btu-in./hr.ft .sup.2 .degree.F., preferably less than about 0.120 Btu-in./hr.ft.sup.2 .degree.F. These foams are particularly useful as insulation materials.

REFERENCES:
patent: 4927863 (1990-05-01), Bartlett et al.
patent: 4943597 (1990-07-01), Grunbauer et al.
patent: 4945119 (1990-07-01), Smits et al.
patent: 4960804 (1990-10-01), Doerge
Database, WPIL, wk 9025, May 10, 1990, AN 188939 & JP-A-2 123 119 (Matsushita Reiki K.K.)-Abstract.
Chemical Abstract Nr. 113(16)133885r.
Database WPIL, wk 9129, Jun. 11, 1991, AN 213185, & JP-A-3 137 138 (Matsushita Reiki K.K.)-Abstract, Chemical Abstract, No. 116(2)7405h.
Database WPIL, wk 9129, Jun. 11, 1991, AN 213184 & JP-A--3 137 137 (Matsushita Reiki K.K.)-abstract, Chemical Abstract, No. 116(2)7404g.

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