Patent
1990-04-16
1992-05-26
Carroll, J.
357 54, 357 72, H01L 2934, H01L 2328
Patent
active
051172720
ABSTRACT:
A semiconductor integrated circuit device having a protective film made of a polymer having a fluorine-containing aliphatic cyclic structure.
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patent: 4933305 (1990-07-01), Kikkawa
patent: 4977199 (1990-12-01), Koleske et al.
patent: 4980268 (1990-12-01), Bartmann et al.
K. Sato et al., "A Novel planar multilevel interconnection technology utilizing polyimide", IEEE Transaction on Parts, Ayamds and Packaging, vol. PHP-9 (Sep. 1973), pp. 176-180.
Patent Abstracts of Japan, vol. 13, No. 278 (C-611) 26 Jun. 1989, & JP-A-01 075575 (Honny Chem Ind Co. Ltd.) 22 Mar. 1989.
Patent Abstracts of Japan, vol. 12, No. 20 (E-575) (2867) 21 Jan. 1988, & JP-A-62 177950 (Hitachi) 01 Aug. 1987.
IEEE Transactions on Electron Devices, vol. ED-26, No. 1, Jan. 1979, New York US pp. 77-83; A. Christo et al.: "Reliability of hybrid encapsulation based on fluorinated polymeric materials" p. 78, Para. A.
Katsushima Hiroshi
Kawasaki Toru
Nakamura Masaru
Nomura Shinzou
Unoki Masao
Asahi Glass Company Ltd.
Carroll J.
NMB Semiconductor Co., Ltd.
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