Hardened photoresist master image mask process

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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148187, 156643, 156657, 1566611, 427 431, 427265, 427340, 427385R, C03C 1500, C03C 2706

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active

042018005

ABSTRACT:
An improved mask fabrication process is disclosed which may be broadly applied to ion-implantation, reactive plasma etching, or the etching of semiconductor structures. The process is based upon the deposition onto an oxide coated or bare semiconductor surface, of a first photoresist layer having formed therein a plurality of windows and which is hardened by a wet chemical technique so as to have an increased resistance to dissolution in solvents. A second photoresist layer is deposited over the surface and windows of the first layer and a subplurality of windows are formed therein over selected windows in the first photoresist layer so as to selectively block a portion of the plurality of windows in the first layer. This composite mask invention may then be employed to carry out an ion-implantation step, wet etching step or reactive plasma etching step on the oxide or semiconductor surface exposed through composite windows. The second layer of photoresist may then be removed and a substitute photoresist layer may be deposited on the surface and windows of the first, hardened photoresist layer and a different subplurality of windows in the substitute layer may be selectively formed over selected windows in the hardened photoresist layer, thereby selectively blocking a different combination of windows in the first, hardened layer.

REFERENCES:
patent: 4068018 (1978-01-01), Hashimoto et al.
patent: 4088490 (1978-05-01), Duke et al.

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