Hardenable composition, hardening product, process for...

Stock material or miscellaneous articles – Composite – Of silicon containing

Reexamination Certificate

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Details

C525S478000, C525S479000, C528S015000, C528S034000, C528S013000, C438S137000

Reexamination Certificate

active

07371462

ABSTRACT:
The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency.A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

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