Hard solder alloy for bonding oxide ceramics to one another or t

Details Hard solder alloy for bonding oxide ceramics to one another or t Hard solder alloy for bonding oxide ceramics to one another or t

1984-04-16

1986-04-08

Ramsey, Kenneth J.

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228122, 228198, 22826312, 22826316, B26B 3530

Patent

active

045807140

ABSTRACT:
The invention provides a hard solder alloy for bonding oxide ceramics to each other or to metal, particularly to alloy steels. The hard solder alloy comprises 65-80% copper, 15-35% titanium, 0.5-5% aluminum and 0.5-5% vanadium. The invention also provides a method of bonding the surfaces utilizing said hard solder alloy as the soldering alloy. The invention further provides a preferred method in which the said hard solder alloy is provided in the form of two components, namely copper and the alloy TiAl.sub.6 V.sub.4.

REFERENCES:
patent: 3517432 (1970-06-01), Sandstrom
patent: 4426033 (1984-01-01), Mizuhara
patent: 4448853 (1984-05-01), Fischer et al.
Nesse, "Untersuchungen zum Aktivloten von Keramik und Graphit", Metallwissenschaft und Technik, vol. 27, Mar. 1973, No. 3, pp. 259-265.

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