Hard facing of metal substrates

Details Hard facing of metal substrates Hard facing of metal substrates

1980-06-13

1982-01-26

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

75203, 75239, 21914651, 219137WM, 219 7614, 427 59, 427 61, 427190, 427319, 427423, C22C 2900

Patent

active

043128947

ABSTRACT:
Method for hard-facing substrates is disclosed using a hard facing material consisting essentially of at least one vanadium carbide. In a particular embodiment of the invention tungsten is present in the hard facing material in solid solution with vanadium carbide.

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Highveld Vanadium News #3 (1974).
Gurevich et al., "X-Ray Study of the System Vanadium Carbide (VC)-Tungsten Carbide (WC)" [Translated from Metallovedenie i Obrabotka Metallov, Jan. 1958, #1, pp. 7-10.

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