Handling device and handling method for wafers

Details Handling device and handling method for wafers Handling device and handling method for wafers

2011-03-22

2011-03-22

Kramer, Dean J (Department: 3652)

Handling: hand and hoist-line implements

Contact lens applicator

C294S086400, C414S941000

Reexamination Certificate

active

07909374

ABSTRACT:
The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

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