Handling bodies containing bonding material

Metal fusion bonding – Process – Plural joints

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Details

228 6A, 29843, B23K 112, H05K 104

Patent

active

044212666

ABSTRACT:
Bodies (22) containing bonding material are applied in a substantially simultaneous manner to each of an array of bonding sites (18). A member (50) holds the bodies (22) in an array corresponding to the array of bonding sites (18). A pickup head (40) holds an array of pickup pins (42) such that pickup ends thereof correspond to the array of bodies (22) and sites (18). A mechanism (31) manipulates the head (40) and the array of pins (42) in steps, to substantially simultaneously engage each of the bodies (22) in the member (50) with a corresponding pickup end of a pin (42), to substantially simultaneously contact each of the bodies (22) to a corresponding bonding site (18) and to substantially simultaneously disengage the pins (42) from the bodies (22). In a preferred embodiment, the bodies (22) contain solder which is readily conductive and frictionally engageable by pressure of the pins (42) upon the bodies (22).

REFERENCES:
patent: 245410 (1881-08-01), Sheldon
patent: 1523633 (1925-01-01), Cousar et al.
patent: 2125112 (1938-07-01), Ingham
patent: 2204496 (1940-06-01), Hogue
patent: 2220741 (1940-11-01), Thorson
patent: 2645006 (1953-07-01), Hadley
patent: 3320658 (1967-05-01), Bolda et al.
patent: 3694614 (1972-09-01), Bihler
patent: 4132341 (1979-01-01), Bratschum

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