Measuring and testing – Vibration – By mechanical waves
Reexamination Certificate
2008-07-21
2011-10-11
Chapman, Jr., John (Department: 2856)
Measuring and testing
Vibration
By mechanical waves
Reexamination Certificate
active
08033172
ABSTRACT:
The present invention relates to a flaw detector imaging apparatus for detecting and visualizing a flaw in a target material to be investigated, comprising an ultrasonic phase-array probe comprising an array of ultrasonic transducers and a flaw detector. The flaw detector includes at least one trigger channel to trigger ultrasonic emitting transducers of the array at respective time delays to produce an ultrasonic beam propagating through the target material, and a single receiver channel to receive echo signals produced by ultrasonic receiving transducers of the array in response to ultrasonic wave echoes reflected from a flaw in the target material. The single receiver channel comprises a delay circuit imparting to the received echo signals the respective time delays as used in the triggering of the ultrasonic emitting transducers and a combiner of the delayed echo signals. A processor is responsive to the echo signals produced by the ultrasonic receiving transducers, received by the single receiver channel and time delayed by the delay circuit to produce an image of the flaw from which the ultrasonic wave echoes are reflected. A display connected to the ultrasonic processor displays the image of the flaw.
REFERENCES:
patent: 4127034 (1978-11-01), Lederman et al.
Abatte Agostino
Langlois Pierre
Quiles, legal representative Josefina R.
Chapman, Jr. John
Olympus NDT
Ostrolenk Faber LLP
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