Hammer for forming bulges in an array of compliant pin blanks

Details Hammer for forming bulges in an array of compliant pin blanks Hammer for forming bulges in an array of compliant pin blanks

1997-06-18

1999-03-09

Vo, Peter

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29757, 29761, H05K 330, H01R 4300

Patent

active

058784837

ABSTRACT:
A hammer for forming bulges in an array of compliant pin blanks by compressive deformation to thereby attach the array of pin blanks to a printed circuit board is provided. Each of the compliant pin blanks has a substrate engaging portion and a compliant section spaced from the substrate engaging portion projecting from the printed circuit board. The compliant section of each pin blank defines at least one protrusion extending outwardly farther than the remaining portions of the compliant section of the pin blank. The circuit board has a plurality of holes receiving the pin blanks. A hammer is provided which has a body defining a substrate facing surface for facing the printed circuit board and defining a plurality of holes extending from the substrate facing surface for receiving the compliant sections of the pin blanks. The holes in the substrate facing surface have a bulge cavity larger than the cross-section of the portion of the pin receiving blank therein. The compressive stress of the pin blanks will cause the blanks to be formed in the bulge cavities.

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