Halogen-free resin composition

Details Halogen-free resin composition Halogen-free resin composition

2005-05-31

2005-05-31

Feely, Michael J. (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S110000, C525S113000, C525S114000, C525S115000, C525S118000, C525S523000, C525S529000

Reexamination Certificate

active

06900269

ABSTRACT:
Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I):wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

REFERENCES:
patent: 5021484 (1991-06-01), Schreiber et al.
patent: 5176780 (1993-01-01), Schreiber et al.
patent: 5443911 (1995-08-01), Schreiber et al.
patent: 6780511 (2004-08-01), Gerber

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