Halogen-free flux mixture and use thereof

Metal fusion bonding – Process – With protecting of work or filler or applying flux

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148 23, B23K 3534

Patent

active

048384780

ABSTRACT:
A halogen-free flux mixture for solder wires having one flux core or a plurality of flux cores based on natural and/or synthetic resins, organic acids, and optionally further additives contains from 20 to 80% by weight of resin, at least 2 organic acids in a ratio of from 1:5 to 5:1 and has an acid value of the total mixture of at least 200. Using said flux mixture, solder wires having one flux core or a plurality of flux cores of from 0.2 to 1.0% by weight can be produced which solder wires meet all requirements, including those made for the SMT technique.

REFERENCES:
patent: 4278479 (1981-07-01), Anderson et al.
patent: 4428780 (1984-01-01), Schedroff
patent: 4708751 (1987-11-01), Froebel et al.
patent: 4759490 (1988-07-01), Ochiai
patent: 4762573 (1988-08-01), Biverstedt
Search Report of corresponding European Patent Application 88 105 958.8.

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