Halogen-free flameproof epoxy resin formulations

Details Halogen-free flameproof epoxy resin formulations Halogen-free flameproof epoxy resin formulations

2011-05-31

2011-05-31

Truong, Duc (Department: 1765)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S403000, C528S220000, C528S230000, C528S398000, C528S403000, C528S486000, C528S487000

Reexamination Certificate

active

07951878

ABSTRACT:
The invention relates to a method for preparing halogen-free flameproof epoxy resins, in which a halogen-free epoxy resin is reacted with a polyfunctional aldehyde or ketone and a phosphinic acid derivative, wherein the phosphinic acid derivative contains at least one P—H-active structural unit of the formula ═PH(O) and is used in an amount equivalent to the polyfunctionality of the aldehyde or ketone, to a halogen-free flameproof epoxy resin obtainable by this method, to the use of the epoxy resin as a base material for the manufacture of printed circuit boards and printed circuits and to intermediates used to prepare the epoxy resins.

REFERENCES:
patent: 4086206 (1978-04-01), Saito et al.
patent: 4127590 (1978-11-01), Endo et al.
patent: 4529533 (1985-07-01), Chasar
patent: 4742088 (1988-05-01), Kim
patent: 5821376 (1998-10-01), Rathfelder et al.
patent: 6797821 (2004-09-01), Wang et al.
patent: 7115765 (2006-10-01), Sprenger et al.
patent: 2002/0035233 (2002-03-01), Wang et al.
patent: 2005/0038279 (2005-02-01), Dittrich et al.
patent: 2 034 887 (1972-01-01), None
patent: 26 46 218 (1977-04-01), None
patent: 195 22 876 (1996-11-01), None
patent: 102 06 982 (2003-09-01), None
patent: 103 59 269 (2005-07-01), None
patent: 0 106 169 (1984-04-01), None
patent: 0 806 429 (1997-11-01), None
patent: 61-162541 (1986-07-01), None
patent: 2001-172555 (2001-06-01), None
patent: 2001-323268 (2001-11-01), None
patent: 2001 354685 (2001-12-01), None
patent: 2002-284850 (2002-10-01), None
patent: 2003-105058 (2003-04-01), None
patent: WO 02/14334 (2002-02-01), None
patent: WO 2004/024791 (2004-03-01), None
Wang et al., Synthesis and properties of epoxy resins containing 2-(6-oxid-6H-dibenz(c,e)(1,2) oxaphosphorin-6-yl) 1,4-benzenediol (II), Department of Chemical Engineering, National Cheng Kung University, Polymer 41 (2000), pp. 3631-3638.
Shieh, et al., “Effect of the Organophosphate Structure on the Physical and Flame-Retardant Properties of an Epoxy Resin”, Journal of Polymer Science, vol. 40, 369-378 (2002).
Liu et al., “Phosphorus-Containing Epoxy for Flame Retardant. III: Using Phosphorylated Diamines as Curing Agents”, J. Appl. Polym Sci. 63: 895-901, 1997.
Liu et al., “Synthesis, Characterization, Thermal and Flame Retardant Properties of Phosphate-Based Epoxy Resins”, J. Polym Sci A: Polym Chem 35: 565-574, 1997.
Levchik, et al., “Thermal Decomposition of Cyclotriphosphazenes. I. Alkyl-Aminoaryl Ethers”, J. Appl. Polym Sci 67: 461-472, 1998.
Lu et al., “Recent developments in the chemistry of halogen-free flame retardant polymers”, Prog. Polym Sci. 27: 1661-1712, 2002.
Levchik et al., “Epoxy resins cured with aminophenylmethylposphine oxide—II. Mechanism of thermal decomposition”, Polymer Degradation and Stability 60, 169-183, 1998.
European Office Action dated Oct. 15, 2010 (4 pages).
Notice of Allowance in Applicants' related U.S. Appl. No. 10/598,012, filed Aug. 15, 2006 and allowed Nov. 17, 2010.
Toshio Koizumi, “Pd(0) catalyzed polyaddition of bifunctional vinyloxiranes with 1, 3-dicarbonyl compounds” Journal of Polymer Science: Part A: Polymer Chemistry, vol. 40, 2002, pp. 2487-2494.
International Preliminary Report on Patentability, PCT/Written Opinion of ISR Authority, Apr. 2005.
PCT International Search Report and Written Opinion, dated Mar. 7, 2006.

Affiliated with

Also associated with

Rating

Halogen-free flameproof epoxy resin formulations does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Halogen-free flameproof epoxy resin formulations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Halogen-free flameproof epoxy resin formulations will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2627880