Halogen additives for alkaline copper use for plating zinc die c

Details Halogen additives for alkaline copper use for plating zinc die c Halogen additives for alkaline copper use for plating zinc die c

1998-11-11

2000-04-25

Mayekar, Kishor

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

205296, 205239, 106 126, C25D 338

Patent

active

060540370

ABSTRACT:
A method and electrolyte bath for depositing Cu.sup.+1 ions from the cathode diffusion layer onto a zinc substrate. Halogen ions are used as additives to organophosphonate alkaline copper electrolytes for stabilizing Cu.sup.+1 in the cathode diffusion layer.

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patent: 5750018 (1998-05-01), Brasch
Interzinc, Zinc Casting, A Systems Approach, Eastern Alloys, Inc., pp. 6-7. "Comparison of Typical Casting Alloy Properties" (table). No date available.

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