Half-bridge power module with insert molded heatsinks

Details Half-bridge power module with insert molded heatsinks Half-bridge power module with insert molded heatsinks

2006-12-12

2006-12-12

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C257S707000, C257S712000

Reexamination Certificate

active

07149088

ABSTRACT:
A power module which includes heatsinks made of AlSiC and power semiconductor devices directly mounted thereon.

REFERENCES:
patent: 5398160 (1995-03-01), Umeda
patent: 5521437 (1996-05-01), Oshima et al.
patent: 5625536 (1997-04-01), Soyano et al.
patent: 5691884 (1997-11-01), Soyano et al.
patent: 5703399 (1997-12-01), Majumdar et al.
patent: 5767573 (1998-06-01), Noda et al.
patent: 5808359 (1998-09-01), Muto et al.
patent: 6147869 (2000-11-01), Furnival
patent: 6272015 (2001-08-01), Mangtani
patent: 6310775 (2001-10-01), Nagatomo et al.
patent: 6320747 (2001-11-01), Jahn et al.
patent: 6421244 (2002-07-01), Shinohara et al.
patent: 6509629 (2003-01-01), Yoshimatsu et al.
patent: 6703703 (2004-03-01), Grant
patent: 6885097 (2005-04-01), Maeno et al.
patent: 6979594 (2005-12-01), Fan et al.
patent: 6979909 (2005-12-01), Shinohara
patent: 6995461 (2006-02-01), Soyano et al.

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