Drug – bio-affecting and body treating compositions – Effervescent or pressurized fluid containing – Organic pressurized fluid
Patent
1978-07-26
1980-03-11
Helfin, Bernard
Drug, bio-affecting and body treating compositions
Effervescent or pressurized fluid containing
Organic pressurized fluid
812751, 252305, 424DIG1, 424 70, 424 71, A61K 711
Patent
active
041928628
ABSTRACT:
The invention relates to a hairspray product having improved hair-holding properties. The hairspray composition comprises, as is usual, a solution of a hairspray resin in a suitable solvent, but to improve the holding power there is also included a minor amount of a drag reducing agent which is soluble in the solvent for the hairspray resin. The drag reducing agent is present in an amount such that the weight ratio of the hairspray resin to the drag reducing agent is 10,000 to 2:1. The drag reducing agent amounts to less than 0.3% by weight of the composition.
REFERENCES:
patent: 2723248 (1955-11-01), Wright
patent: 3142622 (1964-07-01), Clapp
patent: 3210251 (1965-10-01), Klug
patent: 3360356 (1967-12-01), Vartiak
patent: 3479427 (1969-11-01), Lieberman et al.
patent: 3715428 (1973-02-01), Quasius et al.
patent: 3790664 (1974-02-01), Krochock et al.
patent: 3876760 (1975-04-01), Nersesian et al.
patent: 3914403 (1975-10-01), Valan
patent: 3922341 (1975-11-01), Abegg et al.
patent: 3928558 (1975-12-01), Cheesman et al.
patent: 3958581 (1976-05-01), Abegg et al.
patent: 3959463 (1976-05-01), Nersesian et al.
patent: 3984536 (1976-10-01), Viout et al.
Clarke Vera C.
Helfin Bernard
Lever Brothers Company
LandOfFree
Hairspray containing a hairspray resin and a drag reducing agent does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hairspray containing a hairspray resin and a drag reducing agent, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hairspray containing a hairspray resin and a drag reducing agent will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2000949