1999-04-14
2000-08-08
Payer, Hwei-Siu
Cutlery
Cutting tools
Saw
030506, 030507, B27B 2102
Patent
active
060982942
ABSTRACT:
An improved hacksaw for rigorous use has two embodiments, one with a high available cutting depth exceeding five inches, and another with a low clearance with attendant low cutting depth. The saw is easily constructed of inexpensive materials and has a blade alignment bow whereby forces exerted on the bow by the blade are closely aligned to minimize lateral bending and enable precise cuts.
REFERENCES:
patent: D244666 (1977-06-01), Kaywood
patent: D325506 (1992-04-01), Michas et al.
patent: 648992 (1900-05-01), Peterson
patent: 803694 (1905-11-01), Jones
patent: 903495 (1908-11-01), Parsons
patent: 948151 (1910-02-01), Ullrich
patent: 1190477 (1916-07-01), Sprague
patent: 1929989 (1933-10-01), Priest
patent: 2102782 (1937-12-01), Blum
patent: 2213841 (1940-09-01), Hubeck
patent: 2221231 (1940-11-01), Cassidy
patent: 2799309 (1957-07-01), Olesen
patent: 3822731 (1974-07-01), Keymer
patent: 4256156 (1981-03-01), Biszantz et al.
patent: 5063675 (1991-11-01), Michas et al.
patent: 5388333 (1995-02-01), Chen
patent: 5706585 (1998-01-01), Wang
patent: 5873170 (1999-02-01), Stanley
Erickson Allen H.
Payer Hwei-Siu
LandOfFree
Hack saw does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hack saw, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hack saw will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1138296