Guide hole sleeves for boat transports supporting semiconductor

Details Guide hole sleeves for boat transports supporting semiconductor Guide hole sleeves for boat transports supporting semiconductor

1992-08-21

1994-01-04

Heinrich, Samuel M.

Metal fusion bonding

With means to handle work or product

228 39, 269900, 118406, B23K 3704

Patent

active

052753263

ABSTRACT:
Damage to the pins and ceramic body of pin grid array type semiconductor device assemblies is avoided by providing ceramic bushings in the pin-receiving holes of a boat transport. The bushings elevate the package body above the platform surface of the boat, and also alleviate problems associated with unequal thermal expansion of the metal boat and the ceramic package. In an alternate embodiment, a ceramic insert formed as a square ring encompassing an area roughly equivalent to the area of the package body is provided with holes for receiving the pins, and the boat transport has a cavity for receiving and retaining the ceramic insert.

REFERENCES:
patent: 2964007 (1960-12-01), Buffington
patent: 3088191 (1963-05-01), Breiling
patent: 4421265 (1983-12-01), Boyer et al.
patent: 5130164 (1992-07-01), Hutchison

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