Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-01-29
2002-10-15
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S692000, C361S697000, C257S719000, C165S104330
Reexamination Certificate
active
06466442
ABSTRACT:
BACKGROUND OF THE INVENTION
This application is a continuation-in-part (C-I-P) of the U.S. Patent application entitled “Self-recirculated Heat Dissipating Means for Cooling Central Processing Unit” (hereinafter defined as “Prior Application”) filed on: Nov. 24, 2000 by the same inventor of this application.
The prior application disclosed a heat dissipating device for cooling central processing unit (CPU) by filling a vaporizable coolant in a barrel having fins and cooling fan provided on the barrel; whereby upon absorption of heat from CPU, the coolant will absorb heat of vaporization to become vapor which is then contacted with the barrel wall as cooled by the fan to be condensed as a liquid coolant for completing a liquid-vapor two phase recirculation for dissipating the heat from CPU.
However, the prior application did not disclose any capillary device for capillarily draining the condensed liquid coolant into the bottom portion of the barrel, thereby influencing the heat dissipating efficiency for removing heat from the CPU.
The present inventor has found the drawback of the prior application and invented the present heat dissipating means for guidably recirculating the coolant for increasing the heat dissipating efficiency for cooling CPU.
SUMMARY OF THE INVENTION
The object of the present invention is to provide a heat dissipating device including: a barrel having a plurality of fins formed on the barrel and having a buckle for fastening the barrel to a base board of a central processing unit (CPU) to conduct heat from CPU towards the barrel; a cooling fan contiguous to the fins and the barrel for cooling the fins and the barrel; a vaporizable coolant filled in the barrel; a guiding device provided in the barrel for guiding and ejecting the vapor as vaporized from a liquid coolant when absorbing the heat from CPU towards a cooled inside wall of the barrel to be condensed as a liquid coolant; and a capillary device formed on the inside wall for capillarily osmetically draining the liquid coolant towards a bottom of the barrel for enhancing a liquid-vapor two phase recirculation of the coolant for efficiently dissipating heat from the CPU.
REFERENCES:
patent: 3673306 (1972-06-01), Kirkpatrick
patent: 3789920 (1974-02-01), Low et al.
patent: 3800190 (1974-03-01), Marek
patent: 3857441 (1974-12-01), Arcella
patent: 3865184 (1975-02-01), Grover
patent: 3955619 (1976-05-01), Corman et al.
patent: 3971435 (1976-07-01), Peck
patent: 4012770 (1977-03-01), Pravda et al.
patent: 4212349 (1980-07-01), Andros et al.
patent: 4633371 (1986-12-01), Nagy et al.
patent: 4951740 (1990-08-01), Peterson et al.
patent: 4966226 (1990-10-01), Hamburgen
patent: 5219021 (1993-06-01), Edelstein et al.
patent: 5412535 (1995-05-01), Chao et al.
patent: 5632158 (1997-05-01), Tajima
patent: 5871043 (1999-02-01), Osakabe et al.
patent: 6085831 (2000-07-01), DiGiacomo et al.
patent: 6330908 (2001-12-01), Lee et al.
patent: 6336497 (2002-01-01), Lin
Datskovsky Michael
Tolin Gerald
LandOfFree
Guidably-recirculated heat dissipating means for cooling... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Guidably-recirculated heat dissipating means for cooling..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Guidably-recirculated heat dissipating means for cooling... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2988953