Guard ring for integrated circuit package

Details Guard ring for integrated circuit package Guard ring for integrated circuit package

1995-01-13

1996-08-13

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257671, 257787, H01L 2302

Patent

active

055458505

ABSTRACT:
There is provided a leadframe having a plurality of coplanar electrically conductive leads. At least one metallic guard is bonded to the leads with a dielectric layer disposed between the metallic guard and the leads. The metallic guard has good adhesion to a polymer molding resin such that when the leadframe structure is encased in a molding resin, delamination is minimized. By restricting delamination, the ingress of water and water soluble contaminants to an integrated circuit device is inhibited.

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