Guard ring extension to prevent reliability failures

Details Guard ring extension to prevent reliability failures Guard ring extension to prevent reliability failures

2011-06-28

2011-06-28

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

Mesa structure

C257S127000, C257S170000, C257S409000, C257S484000, C257S620000, C257SE23002, C257SE29013

Reexamination Certificate

active

07968976

ABSTRACT:
An embodiment of the present invention is a technique to prevent reliability failures in semiconductor devices. A trench is patterned in a polyimide layer over a guard ring having a top metal layer. A passivation layer is etched at bottom of the trench. A capping layer is deposited on the trench over the etched passivation layer. The capping layer and the top metal layer form a mechanical strong interface to prevent a crack propagation.

REFERENCES:
patent: 6046101 (2000-04-01), Dass et al.
patent: 6352940 (2002-03-01), Seshan et al.
patent: 6753608 (2004-06-01), Tomita
patent: 7394158 (2008-07-01), Carta et al.
patent: 7566915 (2009-07-01), Chang et al.
patent: 2004/0026785 (2004-02-01), Tomita
patent: 2004/0147097 (2004-07-01), Pozder et al.
patent: 2006/0086939 (2006-04-01), Carta et al.
patent: 2006/0133552 (2006-06-01), Subramanian
patent: 2008/0157284 (2008-07-01), Chang et al.
patent: 2008/0286968 (2008-11-01), Carta et al.
patent: 2009/0200548 (2009-08-01), Chang et al.
patent: 2010/0187528 (2010-07-01), Chang et al.
patent: 2010/0197114 (2010-08-01), Jeng et al.

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