GT clip design for an electronic packaging assembly

Details GT clip design for an electronic packaging assembly GT clip design for an electronic packaging assembly

1997-07-15

1999-03-16

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 257719, H05K 720

Patent

active

058837833

ABSTRACT:
An electrical assembly which includes a clip that couples a thermal element to an integrated circuit package. The integrated circuit package is mounted to a printed circuit board. An elastomer is located between the printed circuit board and the clip. The assembly is designed so that the elastomer applies a pre-load force which pulls the thermal element into the integrated circuit package. The pre-load is typically set so that the thermal element does not become separated from the package when the assembly is subjected to external shock and vibration loads. The elastomer applies the pre-load force uniformly along the area of contact with the printed circuit board. The elastomer does not create localized high stress points on the board. Additionally, the elastomer has an inner opening that is larger than the outer dimensions of the integrated circuit package so that the elastomer applies the pre-load force onto the board in an area away from the solder joints of the package.

REFERENCES:
patent: 4658331 (1987-04-01), Berg
patent: 5305185 (1994-04-01), Samaruu et al.
patent: 5557503 (1996-09-01), Isaacs et al.
patent: 5662163 (1997-09-01), Mira

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