Growth of inorganic thin films using self-assembled...

Details Growth of inorganic thin films using self-assembled... Growth of inorganic thin films using self-assembled...

2005-06-17

2010-11-09

Lightfoot, Elena T (Department: 1715)

Coating processes

Applying superposed diverse coating or coating a coated base

Metallic compound-containing coating

C427S402000, C427S255400, C427S255600

Reexamination Certificate

active

07829150

ABSTRACT:
Systems and methods for preparing inorganic-organic interfaces using organo-transition metal complexes and self-assembled monolayers as organic surfaces. In one embodiment, a silicon wafer is cleaned and reacted with stabilized pirhana etch to provide an oxide surface. The surface is reacted with the trichlorosilyl end of alkyltrichlorosilanes to prepare self assembling monomers (SAMs). The alkyltrichlorosilanes have the general formula R1-R—SiCl3, where R1 is —OH, —NH2, —COOH, —SH, COOCH3, —CN, and R is a conjugated hydrocarbon, such as (CH2)nwhere n is in the range of 3 to 18. The functionalized end of the SAM can optionally modified chemically as appropriate, and is then reacted with metal-bearing species such as tetrakis(dimethylamido)titanium, Ti[N(CH3)2]4, (TDMAT) to provide a titanium nitride layer.

REFERENCES:
patent: 4539061 (1985-09-01), Sagiv
patent: 4735702 (1988-04-01), Reinhoudt et al.
patent: 4992300 (1991-02-01), Ogawa et al.
patent: 6755953 (2004-06-01), Baba
patent: 2002/0098346 (2002-07-01), Yitzchaik
patent: 2005/0042888 (2005-02-01), Roeder et al.
patent: 0598361 (1994-05-01), None

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