Group III nitride compound semiconductor devices and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure

Reexamination Certificate

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C257S615000, C257SE33006, C438S481000

Reexamination Certificate

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07462867

ABSTRACT:
A sapphire substrate1is etched so that each trench has a width of 10 μm and a depth of 10 μm were formed at 10 μm of intervals in a stripe pattern. Next, an AlN buffer layer2having a thickness of approximately 40 nm is formed mainly on the upper surface and the bottom surface of the trenches of the substrate1.Then a GaN layer3is formed through vertical and lateral epitaxial growth. At this time, lateral epitaxial growth of the buffer layer21,which was mainly formed on the upper surface of the trenches, filled the trenches and thus establishing a flat top surface. The portions of the GaN layer3formed above the top surfaces of the mesas having a depth of 10 μm exhibited significant suppression of threading dislocation in contrast to the portions formed above the bottoms of the trenches.

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